YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic Technology Co.) PCIe4.0 NVMe1.4 AN4 1TB SSD with a double

What's inside the Apple iPhone 13 Pro Teardown? Autumn already, and another season of new Apple tech is upon us! This year’s iPhone teardown is well under way! We received the iPhone 13 and iPhone 13 Pro today in our labs. Identification and early costing analysis will continue for the next week or

Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm eMRAM products with STT-MRAM technology and

微米B47R NAND内存技术3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process, structure, and die design. Micron 176L 3D NAND

功率半导体技术最新SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer a place for silicon (Si) in power electronics