Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship handsets in the industry. This competitive insight enables visibility into reference design trends and opportunities for design wins.

Provides a better understanding of the key functional blocks that make up the transceiver and estimated cost to manufacture the die.

Provides analysis of key blocks in a die that monitor and manage the power supply for communication of antenna to modem over cellular. This enables better understanding of power supply management.

Focused on highly integrated front-end modules of key RF chips in mobile phones.

Provides analysis of the connection of key blocks in a die for the communication of antenna to modem over cellular.

Provides analyses that explains the connection of key blocks in a die for power supply management.

Builds on the analysis in the Front End Module Architecture channel by analyzing some of the die circuits (i.e. power amplifiers, low noise amplifiers, RF switches, RF filters) found in the front end modules.