支持半导体行业的知识产权战略Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse
An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most
ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung
Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying
SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral
Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions
A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside. As first published in Semiconductor Digest.
四月il 29 - 12:00-1:30 pm (ET) – Live webinar, "Patent Portfolio Management: Effective Strategies and Best Practices in 2020", hosted by The Knowledge Group. Key topics include: Patent Portfolio Management Trends and Developments, The Essentials of an
The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to
Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC has
Contributing Authors: Ray Fontaine Congratulations to the Samsung team for not only delivering a well spec’d camera system, but also for being first to market with 0.7 µm generation pixels! The GH1 stacked imager, announced in September 2019, is in
Here we were, waiting for the release of the Samsung Galaxy S20 so we could see the Qualcomm Snapdragon 865 mobile platform, and along came Xiaomi with their announcement on February 13 that the Mi 10 - also based on the Snapdragon 865 - would be
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.
Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich
Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.
Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device
2019is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung
发布:2019年5月31日高通QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can
We have been closely monitoring the progress of COVID-19 in recent weeks, regularly updating our travel and operations policies to include increasingly strict restrictions we have chosen to implement. Our priority is ensuring the continued health and