Analysis of Apple M1 is Happening – and, Thermal Imaging?

Dick James
迪克·詹姆斯,退休研究员
迪克·詹姆斯是半导体行业近50年的老手,从事半导体器件的工艺开发、设计、制造、封装和逆向工程。Dick是TechStream博客内容的固定贡献者。乐动篮球快讯

2020年12月21日

它遵循了A系列的设计理念,采用了大型高性能内核和小型高效内核的组合,在本例中,两个内核各有四个,而A14则是两个+四个。GPU有八个核心(而不是四个),神经引擎似乎是与A14中相同的16核模块。secure enclave似乎是早期macbook中使用的T2安全芯片的SoC实现。

It is Apple’s second 5-nm part, almost certainly made on the same process as the A14, with 16 billion transistors, compared with the 11.5 Bn in the A14 from the latest iPhone. We obtained a Macbook Air (13-inch, 256 GB) and removed the M1, and our speculation that the package was like the A12X was correct.

Analysis of Apple M1 is Happening – and, Thermal Imaging?

Two new Apple SoCs, two market events: Apple A14 and M1

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