Better data. Better decisions.
Semiconductor Library是一项基于订阅的服务,您可以全天候在线访问全球最大的半导体技术数据和分析库。
我们得到了你正在寻找的东西
通过制造商,通过技术和产品访问丰富的分析来源和产品。
制造商的分析包括:
三星,德克萨斯州,德州仪器,联发,英特尔,苹果,广播,小米,LG,诺基亚,华为等许多其他人。
Products by application include:
Smartphones, Power Supplies and Batteries, Computer Peripherals, Tablets, GPS, Cameras, Wearables, Storage, Automotive, and others.
Devices by technology include:
传感器执行器、通信IC、标准线性/电源、存储器、应用特定模拟、应用特定IC、微控制器等。
支持有价值的用例
Data on thousands of products, components and dies.
“I want to target Company X’s application processors.” - Targeting a manufacturer’s technology
“我有专利并想知道谁是谁使用它。”- 寻找对专利使用的证据
“Who else is using the chip that infringes on my patent?” - Expanding revenue coverage
TechInsights.Library is used by internal IP teams who are spearheading technical research to evaluate their options and plan successful IP campaigns. Specifically, legal personnel, program managers, and engineers use Tech Library to:
- Conduct preliminary and deeper dive technical analysis
- Find evidence of use to create litigation-ready claim charts
- 发现竞争对手的产品,组件或模具中的潜在侵权行为
- Find targets that will give the highest potential licensing payback
- Obtain hard, accurate data for planning a potential defensive strategy or assertion case
- Make better decisions about potential patent portfolio acquisition – or culling
- 还有许多其他知识产权,可从信任的来源深入,准确,可靠的分析
Find the technology analysis you need
TechInsights库提供了一个强大的搜索terface so you can quickly find the technology reports, images, schematics, and bills of materials you need to support your patents and find evidence of use.
观看下面的视频以了解有关TechInsights图书馆的更多信息。
独特的家谱视图可节省您的时间
Only Tech Library enables you to view – and explore in seconds – product, component, and die relationships. See at a glance where re-use occurs to expand your target list!
- 在全球最大的精确半导体技术数据库和分析中提供灵活的在线访问 - 可用24/7
- 在线查看超过5000份报告提供了深刻的见解,揭示了产品的工作原理和原因
- Gives you access to all our data – teardown images, advanced images, reports and schematics
- 快速搜索产品,组件和模具
- 可自定义的搜索查询
- Technology reports include product teardowns, die utilization, structural and process analysis, and circuit extraction
- Unique Genealogy function shows at a glance the relationship between products, components, and dies
- 八月ments conventional research methods such as datasheets, white papers, conference papers
- 支持多种IP用例:
- 断言(licensing, strengthening)
- Transaction (both Buy and Sell sides)
- 防御
- 每日更新意味着您可以立即访问所有最新数据和分析
搜索我们的分析和网站
Recent News and Blogs


两个新的Apple SoC,两个市场事件:Apple A14和M1
可用逻辑订阅>工艺和高级封装>工艺流程>晶体管特性>SoC设计分析>数字平面图分析>分析-数字平面图>标准单元GDS库分析>晶体管
拆除:Velodene Lidar Puck VLP-16传感器(电子技术360)
A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.
网络研讨会:USB-C电源交换机中的新兴GaN技术
USB-C电源交换适配器中的新兴GaN技术This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection
3D flash memory, 176 layers!
So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.
无线充电速度升高 - Teardown Techstream博客
高级技术分析师斯泰西·韦格纳斯泰西Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive
Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends
内存技术2020及以后NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and
Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12
考察苹果iPhone 12的技术和财务影响本文由TechInsights介绍了TechInsights和Bloomberg Intelligence分析师,因为它们分享了对苹果最多的技术和财务见解
STMicroelectronics MasterGaN1内部集成GAN高压半桥-TechStream Power Semiconductor博客
Sinjin Dixon Warren,高级工艺分析师Sinjin Dixon Warren是TechInsights的高级工艺分析师,拥有超过20年的半导体分析经验,是电力电子分析的主题专家(SME)。他拿着一个

网络研讨会:市售存储器设备中的ALD / ALE进程
ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will
10月苹果:Apple iPhone 12 Pro Teardown - Teardown Techstream博客
高级技术分析师斯泰西·韦格纳斯泰西Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive
iPhone相机历史:iphone12的另类与普通
The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last
Micron-Memory Techstream Blog的新GDDR6x
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog
STMicroelectronics在Galaxy Note系列中取代索尼TOF- Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung
一名新的球员在GaN充电器市场出现 - Innoscience Inn650D02发现在Rh-PD65W USB-C充电器内部
Contributed by: Sinjin Dixon-Warren, PhD The emergence of gallium nitride (GaN) technology in the USB-C chargers is a new trend in the semiconductor market. Over the past year, TechInsights has found GaN technology from Navitas and from Power
快速查看三星128L(136T)3D V-NAND - Memory Techstream Blog
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog
USEDIC借助他们的SIC JFET技术 - 电源半导体Techstream博客
Sinjin Dixon Warren,高级工艺分析师Sinjin Dixon Warren是TechInsights的高级工艺分析师,拥有超过20年的半导体分析经验,是电力电子分析的主题专家(SME)。他拿着一个
Avalanche 40 nm pmtj stt-mram- Memory TechStream Blog
Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog
Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog
Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to
网络研讨会:空间,电源,梁 - 缩短艰苦跋涉,以获得5G收发器设计和制造的边缘
空间,动力,梁缩短艰巨,以获得5g收发器设计的边缘,移动射频景观已经变得更具竞争力,引进了5克,辅以相关创新旨在解决各种各样的创新
DRAM, 3D NAND Face New Challenges
Semiconductor Engineering - Various memories and business outlooks are all over the map, sometimes literally, with lots of confusion ahead.
SK hynix 128L 3D PUC NAND (4D NAND)
SK Hynix发布了世界上第一个128层(128L)3D NAND,他们已被称为4D NAND。这是他们在单元(PUC)架构下的外围建造的第二个NAND一代;第一个是他们的96L NAND。在PUC架构中,外围设备
Intels Intel Realsense L515 LIDAR相机
引言激光雷达传感的世界正在不断发展。旋转炮塔Lidars是自主驾驶等应用的常见场所(参见我们的汽车LIDAR Teardown订阅),但它们被新一代固态移位
Webinar: ALD/ALE Process in Commercially Available Logic Devices
2018年商用逻辑器件的ALD/ALE工艺推出了新一代逻辑产品,其特点是以Intel为主打的finFET晶体管及其10nm代微处理器,随后是TSMC和三星
Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. August 12, 2020 Our teams
60年的半导体行业及其改变专利战略
Contributed by: Arabinda Das Today the semiconductor industry is a behemoth whose annual sales revenue crosses US $400 Billion. Over its 60 years of existence, this mature industry has experimented with various models like integrated device
雪佛兰螺栓动力系综述
Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions
Memory Process Webinar: 3D NAND Word Line Pad (WLP)
Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued
Intel’s 10nm Node: Past, Present, and Future – Part 2
有人说,在2017年下半年至2018年上半年的时间框架内,英特尔的10nm节点是如此半生不熟,以至于英特尔不得不为后续产品大幅重新设计其10nm工艺技术。在任何情况下,一个SKU和有限的可用性说明了问题。
Apple计算机:过渡到ARM Chips即将推出
Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San
重新审视精髓APA光学GaH Hemt专利
Posted: June 05, 2020 Contributed by: Sinjin Dixon-Warren, PhD The power electronics industry is in a period of transition. For many years silicon-based devices have dominated the industry, with conventional Si MOSFET transistors being used for lower
松下在专利货币化方面的专长从未如此重要
Like many other businesses, the Japanese heavyweight is under significant financial pressure thanks to the covid-19 pandemic, but its long track record of leveraging its IP assets could prove a saving grace
On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
Wednesday May 27, 2020 / 2:00 p.m. ET Hosted By: Sinjin Dixon-Warren The power electronics industry is in a period of transition. For many years silicon-based devices dominated the industry, with conventional Si MOSFET transistors being used for
The guide to effective NAND patent investigation
通过波形和协议测试对于调查内存技术专利来说,用于使用的证据,TechInsights'Martin Bijman和Neil Macleod将仔细研究顶级NAND专利名称的投资组合,以确定如何不同
Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
介绍YMTC的第二代3D-NAND技术,它使用“XTacking”与内存阵列面对面绑定外围电路而不是旁边。如在半导体摘要中发表的。
SIC电源晶体管工艺流程分析:RoHM SCT30222ALGC11工艺流程
Contributed Author: Sinjin Dixon-Warren The market for Silicon Carbide (SiC) power transistors is expected to grow considerably over the coming years. SiC power transistors have several advantages over traditional silicon-based devices, including
专利组合管理:2020年的有效策略和最佳实践
4月29日 - 12:00-1:30 PM(et) - Live Webinar,“专利组合管理:由知识组托管的”专利组合管理:2020年的有效策略和最佳实践“。主要主题包括:专利组合管理趋势和发展,是一个重要的
选择合适的专利软件以获得更好的效果
There have never been so many IP tools and technology aides on the market, but how do you decide which ones are going to help your business? Martin Bijman of TechInsights explains.
Qualcomm Snapdragon SDR865收发器分析;支持5G Sub-6 GHz和LTE服务
The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to
Looking at the Apple A12Z Bionic System on Chip
Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually no
TechInsights在Samsung Exynos 990中确认三星的真实7LPP进程
去年,三星宣布将EUV引入其在Exynos 9825中使用的7LPP过程。通过分析,我们在9825年的7LPP进程与Exynos 9820中的8LPP过程之间发现了几乎没有差异。现在,我们
YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC has
三星Galaxy S20超级5G摄像头拆除
贡献作者:Ray Fontaine祝贺三星团队不仅提供了一个井规格的相机系统,而且还要首先使用0.7μm的生成像素!2019年9月宣布的GH1堆积成像仪正在
三星Galaxy S20 Ultra 5G拆解分析
Contributing Authors: Daniel Yang, Ray Fontaine It is an especially busy time in TechInsights’ labs. Just a few days after we started the teardown of various models of the Xiaomi Mi 10 flagship series - the world’s first Qualcomm Snapdragon 865
最近分析三星移动射频组件
香农5800 55 m5800a01随着行业的扩张s use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors
小米MI 10拆解分析
我们在这里,等待Samsung Galaxy S20的发布,所以我们可以看到高通公司Snapdragon 865移动平台,并且沿着Xiaomi在2月13日宣布,MI 10 - 也基于Snapdragon 865 - 将是
如果说苹果受到了冠状病毒的伤害,那么它的供应商和竞争对手可能也会受到影响
苹果公司(Apple Inc.)出人意料地警告称,由于冠状病毒(coronavirus)的流行,该公司可能无法实现本季度的销售目标,这对其芯片和其他供应商以及同样依赖中国生产产品的竞争对手来说,都是一个很大的痛点。
最近的Mediatek移动RF组件和分析
MT6303P AN10516CW 2.95 x 1.74 - 180nm移动射频架构在复杂程度上不断增加,以支持多种标准,我们在几乎每几个新手机释放中都发现了新的移动RF组件。在这种写作时
In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
有多少层可以3d闪存堆栈?正如摩天大楼不能无限期地堆积一样,3D闪存的层数也有限。
使用OTP NVM确保智能连接的房屋
The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly


华为伴侣30 pro 5g拆除:卖6399元,完成机器,BOM成本仅为2799元
According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...
Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.

Power Integrations与他们的Powigan技术进行了oem设计胜利
Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations, are driving innovation in the USB adapter market. The USB-C power delivery
东芝-WD联盟3D NAND大规模生产将使用三星TCAT工艺
集微网消息(文/Yuna),据Impress Watch网站报道,东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。

Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
TechInsights于10月31日发布了名为“英特尔核心I7-1065G7”冰湖“10 NM 2ND Gen处理器分析”的摘要报告。
Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.
苹果U1 - 延迟芯片及其可能性
Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this
华为Mate 30 Pro 5G拆卸
Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich
提示网络研讨会:分析NAND Flash和SSD设备的技术
日期:2019年11月6日下午1:00 /下午三点提出nted By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and
英特尔核心I7-1065G7“冰湖”10 NM 2ND Gen处理器分析
Intel has released their first 10 nm 2nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This
SIC MOSFET技术的演变:回顾性
发布时间:2019年10月31日贡献作者:Sinjin Dixon-Warren碳化硅(SIC)是一种广泛使用的工业材料。Carborundum公司的WideScale生产于1893年在发现Acheson过程后,这是
The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights.has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.
Apple U1 TMKA75超宽带(UWB)芯片分析
One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional
TechInsights:iPhone11 Pro Max相机售价73.5美元
TechInsights.publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.
电子移动性如何改变汽车
With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.
E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.
SK hynix 96L 3D PUC NAND Analysis
在全球范围内的储存制造商中,SK Hynix目前拥有NAND闪存市场份额的第5个职位,10.3%。它们是释放9倍层NAND解决方案的最新功能,使用SK Hynix 96L 3D PUC Nand。SK Hynix'96L 3D PUC的开发
在iPhone 11 Pro Max附带的Apple 1720充电器内
发布时间:2019年9月27日贡献作者:Sinjin Dixon-Warren iPhone 11 Pro Max船用Apple 1720 18 W USB-C电源输送充电器。该设备被额定交货5 V和3 A或9 V和2 A.在跟进我们最近的博客中TechInsights.Analyses iPhone 11 Cameras
TechInsights发布了新的Apple iPhone 11 Pro Max Smartphone的拆除报告,其中包含一些信息:
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.
Apple iPhone 11 Pro Max Teardown
Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event
Patent licensing: The patent battleplan
Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.
网络研讨会:准备许可证:使用工具扩展许可证计划
最初呈现:2019年9月19日至12:00至下午1:00 et托管:Martin Bijman许可是一种审判和真实的手段,可以将专利组合货币化,但那些将成功地从专利所有权到专利利润的路径不会
Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
发布时间:2019年9月17日,2018年收入为30.4B美元,在NAND闪存中的16.5%市场份额,23%的市场份额在DRAM中,Micron是存储和内存技术中最大的球员之一。对于那些寻求支持他们的产品的人
How Graphical Solutions Improve 3D NAND Effective Device Density
由Moore的定律驱动,记忆和逻辑芯片半导体制造商通过增加晶体管密度来降低产品成本并提高性能。
网络研讨会:功率半导体– A Market Overview & In-depth SiC and GaN Device Analysis
上一篇广播:2019年9月10日星期二和2019年10月8日的星期二主持:建春徐和仙金迪克森 - 沃伦电力半导体市场估计到2025年底达到32亿美元。通过增加全球需求的推动
Mobile manufacturing: How much do companies earn with the high end?
多年来,高端智能手机在价格上涨,成为普通人的无法实现的设备。
Peloton IPO Preview: All Hype, No Muscle
制造和销售溢价Peloton,守护神ge-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.
Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las
A high-end mobile phone sells almost three times what it costs to manufacture it
考虑到构成这些设备的所有组件(从电池或摄像头到允许应用程序运行的操作系统)的成本,手机的售价几乎是制造成本的三倍

Why I keep writing ’bout holes in the sensor
Dpreview对FujifilM GFX 100中等格式相机的审查显示了具有死像空间用于相位检测自动对焦(PDAF)模块的后果的后果
12月a Technologies Fan-In WLP in Qualcomm PM8150
发布日期:2019年8月29日,WLP市场的风扇预计将以稳定的速度增长;从2018年的29亿美元到2024年的44亿美元,复合年增长率为6.5%。最近的贡献者之一,这个市场是德卡技术,其M系列扇出晶圆级封装
GaN, SiC, and Si technologies in AC Adapters
Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device
Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
2019年是我们看到5G智能手机开始起飞的年。TechInsights在4月份发布了一款三星Galaxy S10 5G拆除的博客,这是世界上第一个韩国的5克手机。Galaxy S10 5G SM-G977N基于三星
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image
第3部分:背部发光的活性Si厚度,深沟槽隔离(DTI)
4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive
Part 2: Pixel Scaling and Scaling Enablers
4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop

第1部分:芯片堆叠和芯片到芯片互连
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image
AMBIQ Micro Apollo 3蓝色超低功耗MCU
发布时间:2019年6月11日AMBIQ Micro Apollo 3蓝色超低功耗MCU MCU市场拥挤和竞争力,拥有全球越来越多的半导体公司在这项技术领域的研发花费;预计这一市场将在2019年达到〜20亿美元
1y DDR4 DRAM from Samsung, SK hynix and Micron
发布时间:2019年6月7日三星LPDDR4X 17 NM 1Y三星DDR4 17 NM 1Y Micron MT40A2G4SA-062E 8GB DDR4前3名DRAM制造商(三星,SK Hynix和Micron)于2017年和2018年达到了Sub-20 NM,引入了1X。一个新的里程碑是

Qualcomm QTM052 MMWAVE天线模块
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges
NAND技术:打开大门
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.
网络研讨会:识别和追查专利侵权者-利用技术证据建立你的主张运动
在它的心中,断言活动依赖于使用的证据(EOU),以证明持续侵权的存在。如果没有人使用专利组合所涵盖的技术,那么您的专利并不那么有价值。相反,当有柜会时,专利组合的价值更大。
Electric Cars Gain Traction, But Challenges Remain
(半导体工程)电池驱动电动汽车预计在2019年的出货量将达到一个里程碑,但这项技术要在市场上获得更广泛的采用,还面临几个重大障碍。
TechInsights.memory technology update from IEDM18
发布时间:2019年4月11日贡献作者:迪克·詹姆斯在去年的IEDM在IEDM的星期天晚上,TechInsights举办了一个接待,亚历德达DAS和jeongdong Choe赋予了吸引了一个宽松的会议与会者的演讲
9x层3D NAND分析
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L
三星Galaxy S10 5G拆除
发布时间:2019年4月9日贡献作者:丹尼尔杨&斯塔奇Wegner它在这里。它在我们的实验室中......上周发生了两个主要的5G活动:Verizon在芝加哥推出了5G网络,并在全球的另一面,三星推出了世界
Analyzing innovations in mobile radio frequency front-end integration
发布时间:2019年4月9日,移动射频前端架构3G和早期4G智能手机相对简单,可以由离散组件构建。今天的移动射频(RF)前端已变得更加复杂
网络研讨会:高密度扇出封装技术-检查和比较
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this
3D NAND Metrology Challenges Growing
(半导体工程)大挑战是表征3D NAND器件的内部部分,该内部包括复杂的材料,多层和微小沟道孔。然后,当您添加更多层时,计量挑战增加
自治车辆正在推动创新
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...
三星Galaxy S10+拆卸
发布时间:2019年3月1日贡献作者:米歇尔·阿拉克,丹尼尔杨,Stacy Wegner,Albert Cowsky我们得到了新的三星Galaxy S10 +一点点!TechInsights从韩国收到Exynos三星Galaxy S10 + SM-G975F / DS,并已进入
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve
联想将新的Snapdragon带到市场上
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to
特斯拉准备将Maxwell的干电极创新应用于电池细胞制造
发布时间:2019年2月7日贡献作者:Marty Bijman和Jim Hines图1 - 特斯拉的投资组合,包括Maxwell和Solarcity收购图2 - Tesla Portfolio Landscapes,显示了哪些发明起源于特斯拉,孤主性,以及
网络研讨会:寻找技术中使用的证据 - 善良,坏的和丑陋
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can
网络研讨会:利用技术证据加强专利
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it
网络研讨会:优化专利起诉以实现更强大、更有价值的专利
最初呈现:2018年10月4日/晚上:下午1:00主办于:Martin Bijman&George Pappas专利加强是指在起诉期间从专利中实现最大潜力的过程 -乐动体育博彩下载
网络研讨会:将领先的STB,流设备和智能电视进行比较 - 设计和BOM视角
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming
汽车专利:所有者,技术和调查EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.
英特尔10 nm逻辑过程分析(Cannon Lake)
发布时间:2018年6月12日英特尔10nm逻辑流程分析TechInsights已找到已久的大炮湖 - I3-8121U CPU内的英特尔10nm逻辑流程,用于Lenovo Ideapad330。这项创新拥有以下内容:逻辑晶体管
SK Hynix 72L 3D NAND分析
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time
网络研讨会:黑匣子揭示-在具有挑战性的产品领域调查专利技术
最初呈现:2018年5月3日至3:15 PM至4:00 PM ET主持:Martin Bijman“黑匣子揭示”是我们用来指的“硬质品” - 技术,这是一个原因或另一个难以分析使用证据。这些可以
优步专利景观是什么样的?
发布时间:2018年2月27日供稿作者:Marty Bijman最近,IAM的Timothy Au发布了一篇博客,介绍了Uber的投资组合。该博客引用了Uber的投资组合构成,并提供了过去5年中他们的IP事件的历史记录
网络研讨会:2018年及以后的公司的专利组合货币化关键考虑因素
最初提交时间:2018年2月20日/美国东部时间下午3:00至5:00主办人:Martin Bijman&George Pappas专利强化是指在起诉期间从专利中实现最大潜在价值的过程-乐动体育博彩下载
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software
Job Vacancy: VP, Financial Controller
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate
Job Vacancy: Software Developer
We are currently seeking a Full Stack Software Developer to join one of our Colorado TechInsights Platform development teams. Do you have a passion for solving complex and interesting problems? Do you strive to learn something new every day? Do you
Job Vacancy: Sales Representative
内部销售代表是上市销售团队的关键成员。与外部销售和营销团队密切合作,您将负责在识别新业务或销售时提出以下情况