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Two new Apple SoCs, two market events: Apple A14 and M1

可用逻辑订阅>流程和高级包装>流程>晶体管表征> SOC设计分析>数字平面图分析>分析 - 数字平面图>标准单元GDS库分析>晶体管

16 Dec

拆除：Velodene Lidar Puck VLP-16传感器(Electronics360)

深入潜入光检测和测距技术中使用的主要部件。张贴在电子360中。

14 Dec

Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters

Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection

09. Dec

3D闪存，176层！

到目前为止，NAND Flash已经显示出白热阶段。不久前，存储供应商仍然“看到闪存的高平台上的风景”，有128层。

09. Dec

Wireless Charging Speeds Up - Teardown TechStream Blog

Stacy Wegner，高级技术分析师Stacy Wegner是TechInsights的拆解部门高级技术分析师，负责确保我们的分析师产生的高度技术数据转化为可消耗的竞争力

08. Dec

Webinar: Memory Technology 2020 and Beyond - NAND, DRAM, Emerging and Embedded Memory Technology Trends

记忆Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and

02. Dec

Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12

An Examination of the Technical and Financial Implications of the Apple iPhone 12 This webinar was presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights on Apple’s most

10 11月

Inside the STMicroelectronics MasterGaN1 Integrated GAN High Voltage Half-Bridge -TechStream Power Semiconductor Blog

Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a

03. 11月

Micro Loading And Its Impact On Device Performance

How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.

02. 11月

Webinar: ALD/ALE Process in Commercially Available Memory Devices

ALD/ALE Process in Commercially Available Memory Devices 2018 saw memory product manufacturers Samsung, Hynix, Toshiba and Micron introducing 64- or 72- stacked layer 3D-NAND devices, and move into 1x generation DRAM devices. This presentation will

28 Oct

October Apples: Apple iPhone 12 Pro Teardown - Teardown TechStream Blog

Stacy Wegner，高级技术分析师Stacy Wegner是TechInsights的拆解部门高级技术分析师，负责确保我们的分析师产生的高度技术数据转化为可消耗的竞争力

26 Oct

iPhone Camera History: iPhone 12's Alternative and Normal

iPhone相机的进化历史也可以被视为手机开发的历史，即使iPhone没有完全遵循CIS技术趋势的推进。只是借此机会，还要通过最后一次

21 Oct

New GDDR6X from Micron - Memory TechStream Blog

河东选择，高级技术研究员博士博士博士是一家高级技术研究员，拥有近30年的半导体流程集成的经验，为DRAM，（v）NAND，SRAM和逻辑器件。他经常提供博客

15 Oct

STMicroelectronics Displaces Sony ToF in Galaxy Note Series - Image Sensor TechStream Blog

Ray Fontaine，产品经理 - 图像传感器射线是世界上卓越的图像传感器技术专家之一，他定期发布图像传感器分析内容和TechInsights订阅者的评论。October 11, 2020 Samsung

11 Oct

一名新的球员在GaN充电器市场出现 - Innoscience Inn650D02发现在Rh-PD65W USB-C充电器内部

贡献：Sinjin Dixon-Warren，博士学位在USB-C充电器中氮化镓（GaN）技术的出现是半导体市场的新趋势。在过去的一年中，TechInsights从Navitas和权力中找到了GaN技术

08. Oct

Quick View on Samsung 128L (136T) 3D V-NAND - Memory TechStream Blog

河东选择，高级技术研究员博士博士博士是一家高级技术研究员，拥有近30年的半导体流程集成的经验，为DRAM，（v）NAND，SRAM和逻辑器件。他经常提供博客

08. Oct

UnitedSiC Takes the Road Less Travelled with their SiC JFET Technology - Power Semiconductor TechStream Blog

Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a

08. Oct

Avalanche 40 nm pMTJ STT-MRAM - Memory TechStream Blog

河东选择，高级技术研究员博士博士博士是一家高级技术研究员，拥有近30年的半导体流程集成的经验，为DRAM，（v）NAND，SRAM和逻辑器件。他经常提供博客

25 九月

混合粘合膨胀from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog

Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to

25 九月

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G chip design and manufacturing

Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing

Space, Power, BEAMs Shorten the trek to gain the edge in 5G transceiver design and manufacturing The Mobile RF landscape has become more competitive with the introduction of 5G, complemented by relevant innovation aimed at addressing varying

23 九月

DRAM，3D NAND面对新的挑战

半导体工程 - 各种记忆和商业前景都在地图上，有时会字面意思，有很多困惑。

21 九月

SK hynix 128L 3D PUC NAND (4D NAND)

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral

14 九月

Inside the Intel RealSense L515 LiDAR Camera

Introduction The world of LIDAR sensing is evolving. Rotating turret LiDARs are commonplace for applications such as autonomous driving (see our Automotive LIDAR teardown subscription), but they are being displaced by a new generation of solid-state

11 九月

网络研讨会：市售逻辑设备中的ALD / ALE过程

ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards

26 八月

三星S5K33D i-ToF with 7 µm Pixel Global Shutter in House

三星S5K33D I-TOF，具有7μm像素全球快门 - 图像传感器Techstream博客

Ray Fontaine，产品经理 - 图像传感器射线是世界上卓越的图像传感器技术专家之一，他定期发布图像传感器分析内容和TechInsights订阅者的评论。8月12日，2020年我们的团队

12 八月

60 years of the Semiconductor industry and its changing patent strategy

贡献：Arabinda DAS今天，半导体行业是一个庞然大物，其年销售收入跨越4000亿美元。在其60年的存在之上，这种成熟的行业已经尝试过各种型号，如集成装置

04. 八月

A Review of the Chevy Bolt Powertrain

Posted: July 09, 2020 Contributed by: Sinjin Dixon-Warren, PhD Electric vehicles (EV) are potentially a disruptive technology in the automotive market. They offer the promise of increased energy efficiency and the potential for reduced emissions

09. Jul

内存过程网络研讨会：3D NAND字线焊盘（WLP）

Wednesday June 24, 2020 / 2:00 p.m. ET Hosted By: Chi Lim Tan 3D NAND, or vertical NAND, with its higher density and lower cost per bit, has been a driving force in the popularity of solid state drives (SSD) thanks to the innovation and continued

24 Jun

英特尔的10nm节点：过去，现在和未来 - 第2部分

有些人说，在2017年的H2 - H1 2018 TimeFrame Intel的10nm节点是如此烘焙，该英特尔必须显着重新设计其10 NM工艺技术的后续产品。无论如何，一个SKU和有限的可用性为自己说话。

17 Jun

Apple计算机：过渡到ARM Chips即将推出

Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San

11 Jun

Revisiting the Seminal APA Optics GaN HEMT Patent

Posted: June 05, 2020 Contributed by: Sinjin Dixon-Warren, PhD The power electronics industry is in a period of transition. For many years silicon-based devices have dominated the industry, with conventional Si MOSFET transistors being used for lower

05. Jun

Panasonic在专利货币化方面的专业知识从未如此重要

像许多其他企业一样，由于Covid-19大流行，日本重量级是重大的经济压力，但它的利用其知识产权资产的长期记录可以证明储蓄恩典

05. Jun

Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN

按需网络研讨会：GAN的电力设备生态系统与IP景观综述

5月27日星期三，2020 / 2:00下午ET主持：Sinjin Dixon-Warren电力电子行业在过渡时期。对于多年的硅基设备主导了该行业，具有传统的Si MOSFET晶体管用于

27 May

有效的NAND专利调查指南

With waveform and protocol testing essential to investigating memory technology patents for evidence of use, TechInsights’ Martin Bijman and Neil MacLeod take a closer look at the portfolios of the top NAND patent owners to determine how different

21 May

解锁YMTC 64层3DXTacking®Nand闪存的秘密

介绍YMTC的第二代3D-NAND技术，它使用“XTacking”与内存阵列面对面绑定外围电路而不是旁边。如在半导体摘要中发表的。

08. May

SIC功率晶体管工艺流程分析: The Rohm SCT3022ALGC11 Process Flow

贡献作者：Sinjin Dixon-Warren碳化硅（SIC）电源晶体管的市场预计将在未来几年增长。SIC电源晶体管与传统的基于硅的设备有几个优点，包括

05. May

Patent Portfolio Management: Effective Strategies and Best Practices in 2020

4月29日 - 12：00-1：30 PM（et） - Live Webinar，“专利组合管理：由知识组托管的”专利组合管理：2020年的有效策略和最佳实践“。主要主题包括：专利组合管理趋势和发展，是一个重要的

29 4月

选择合适的专利软件以获得更好的结果

市场上从未如此多的IP工具和技术助攻，但您如何决定哪些是哪些能够帮助您的业务？TechInsights的Martin Bijman解释道。

29 4月

Qualcomm's Snapdragon SDR865 Transceiver

分析高通Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services

The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to

27 4月

Looking at the Apple A12Z Bionic System on Chip

Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually no

15 4月

TechInsights.Confirms Samsung’s true 7LPP process in the Samsung Exynos 990

Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we

18 Mar

YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips

Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC has

12 Mar

三星Galaxy S20超级5G摄像头拆除

贡献作者：Ray Fontaine祝贺三星团队不仅提供了一个井规格的相机系统，而且还要首先使用0.7μm的生成像素！2019年9月宣布的GH1堆积成像仪正在

04. Mar

三星Galaxy S20 Ultra 5G Teardown Analysis

贡献作者：Daniel Yang，Ray Fontaine这是TechInsights'实验室中特别忙碌的时光。在我们开始拆除Xiaomi Mi 10旗舰系列的各种型号之后的几天 - 世界上第一个Qualcomm Snapdragon 865

04. Mar

Recent Analysis of Samsung’s Mobile RF Components

Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors

03. Mar

Xiaomi Mi 10 Teardown Analysis

Here we were, waiting for the release of the Samsung Galaxy S20 so we could see the Qualcomm Snapdragon 865 mobile platform, and along came Xiaomi with their announcement on February 13 that the Mi 10 - also based on the Snapdragon 865 - would be

19 Feb

If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too

Apple Inc的惊喜警告认为，由于冠状病毒流行病，这可能会缺乏本季度的销售目标，因为它的芯片和其他供应商以及也依赖中国建立产品的竞争对手。

18 Feb

Recent MediaTek Mobile RF Components and Analysis

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing

15 1月

In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks

How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.

08. 1月

Securing Smart Connected Homes with OTP NVM

The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly

06. 1月

PC technology trends 2020-DRAM and Flash

新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。

04. 1月

Apple即将添加第三个OLED供应商

这deal has been years in the making. China's BOE Technology Group has been angling to supply Apple with OLED displays destined for iPhones since early 2017.

31 Dec

Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan

According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...

30 Dec

深度拆除华为Mate30 Pro 5G：来自日本的2,000多种组成部分

From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.

26 Dec

Imaging + Sensing End-of-Year Highlights

Huawei Leads Imaging Chip Area Arms Race, Sony Wins Big with i-ToF, Emergence of Event-Driven Vision Sensors Posted: December 18, 2019 Contributing Authors: Ray Fontaine, Senior Technology Analyst Samsung, Huawei and Apple continue to push more

17 Dec

What’s Next For High Bandwidth Memory

分解记忆墙的不同方法。

17 Dec

Seoul Semiconductor patent auction analysis reveals a mixed bag of assets

首尔半导体最近将其脚趾浸入专利市场的销售方面，并宣布将拍卖两种专利包 - 在本月底和1月份的另一个专利包。

12 Dec

Power Integrations与他们的Powigan技术进行了oem设计胜利

发布时间：2019年12月12日贡献作者：Sinjin Dixon-Warren，PHD消费者对较小的形状因素和更高权力的需求，以及政府效率法规，正在推动USB适配器市场的创新。USB-C电源交付

12 Dec

Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process

集微网消息（文件/ yuna），据印象手表网站报告，东芝在12月8日召开的IEDM会议上调在3D NAND闪存量产中间使用类似于三星TCAT的存储单位结构。

12 Dec

Developing a successful licensing program

As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.

25 11月

DRAM Scaling Challenges Grow

More nodes and alternative memories are in the works, but schedules remain murky.

21 11月

Comet Lake for desktop will appear around February 2020? Intel CPU roadmap

TechInsights.released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .

18 11月

Kirin 990 5G核心数据曝光：113.31平方毫米集成103亿晶体管

Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.

12 11月

The Apple U1 - Delayering the Chip and Its Possibilities

Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this

08. 11月

Huawei Mate 30 Pro 5G Teardown

介绍麒麟990 5克发布:11月7日,201.9 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich

07. 11月

提示网络研讨会：分析NAND Flash和SSD设备的技术

Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and

06. 11月

Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis

英特尔已将其前10名NM 2ND Gen处理器发布为消费产品 - 英特尔酷睿i7-1065G7处理器，更好地称为冰湖。戴尔和微软已经宣布将冰湖列入其中一些最新产品。这

31 Oct

The Evolution of SiC MOSFET Technology: A Retrospective

Posted: October 31, 2019 Contributing Author: Sinjin Dixon-Warren Silicon carbide (SiC) is a widely used industrial material. Widescale production by the Carborundum Company started in 1893 following the discovery of the Acheson process, which is

31 Oct

Apple iPhone 11,11 Pro＆11 Pro Max评论：性能，电池和相机升高

TechInsights.has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.

27 Oct

Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis

One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional

24 Oct

TechInsights.: iPhone 11 Pro Max Cameras Cost $73.5

TechInsights.publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.

09. Oct

How e-mobility is changing the Automotive

With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.

07. Oct

E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars

At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.

07. Oct

SK hynix 96L 3D PUC NAND Analysis

Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC

27 九月

Inside the Apple 1720 Charger included with the iPhone 11 Pro Max

Posted: September 27, 2019 Contributing Author: Sinjin Dixon-Warren The iPhone 11 Pro Max ships with the Apple 1720 18 W USB-C power delivery charger. This device is rated to delivery 5 V and 3 A or 9 V and 2 A. In follow up to our recent blog

27 九月

TechInsights.Analyses iPhone 11 Cameras

东北的TechInsights发布拆解报告w Apple iPhone 11 Pro Max smartphone with some info on its cameras:

26 九月

Apple iPhone 11 Pro Teardowns看起来鼓励Stmicro和Sony

STMicroelectronics and Sony似乎可以为Apple的最新旗舰iPhone提供四个筹码。许多其他历史的iPhone供应商也在最新的拆除时出现。

26 九月

Apple iPhone 11 Pro Max Teardown

发布:2019年9月23日-更新:10月1日201.9 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event

23 九月

Patent licensing: The patent battleplan

成功，高回报专利许可计划需要规划。Peter Hanschke的TechInsights提供了一个指南来实现它。

23 九月

网络研讨会：准备许可证：使用工具来扩展许可计划

Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not

19 九月

微米分析概述：LPDDR4 DDR4 3D NAND闪存和XPoint Reverseed

Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product

17 九月

How Graphical Solutions Improve 3D NAND Effective Device Density

由Moore的定律驱动，记忆和逻辑芯片半导体制造商通过增加晶体管密度来降低产品成本并提高性能。

16 九月

网络研讨会：电力半导体 - 市场概览和深度SIC和GAN设备分析

Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more

10 九月

Lithium, the white gold of technology

The price of the mineral collapses, but the batteries continue to consume this white king.

10 九月

Mobile manufacturing: How much do companies earn with the high end?

High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.

08. 九月

Peloton IPO Preview: All Hype, No Muscle

Peloton，生产和销售溢价，大屏幕，固定式健身自行车和跑步机，以及旨在使用该设备的课程的课程订阅，预计将在未来几个月的某个时间公开。

03. 九月

UnMóvildeGamaAlta Se Vende Casi Al Triple de Lo Que Cuesta Fasticarlo

Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las

02. 九月

A high-end mobile phone sells almost three times what it costs to manufacture it

A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to

02. 九月

Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you

Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.

31 八月

Why I keep writing ’bout holes in the sensor

DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules

31 八月

Deca Technologies Fan-in VLP在Qualcomm PM8150

发布时间：2019年8月29日，粉丝在WLP市场预计以稳定增长;2018年的2.9亿美元至44亿美元至2024美元，CAGR 6.5％。该市场的最近贡献者之一是Deca Technologies，其M系列扇出晶圆级包装

29 八月

GaN, SiC, and Si technologies in AC Adapters

Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device

14 八月

Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown

2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung

02. 八月

Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image

30 Jul

Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the

23 Jul

Velodyne LiDAR Puck Teardown

Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive

22 Jul

第2部分：像素缩放和缩放启动器

4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop

16 Jul

AC适配器：GaN，SiC或Si？

Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.

16 Jul

Part 1: Chip-stacking and chip-to-chip interconnect

4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image

09. Jul

Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU

Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019

10 Jun

1y DDR4 DRAM from Samsung, SK hynix and Micron

Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was

05. Jun

How long can Sony keep the top spot in the image sensor market?

不久前，Yuanta Research发布了全球CIS（CMOS图像传感器）的市场数据，指出其整体市场规模仍在迅速增长。

05. Jun

Qualcomm QTM052 mmWave Antenna Module

Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges

31 May

NAND technology: Open the gates

在600亿美元的NAND闪存技术市场,专利景观alysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.

13 May

Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign

在它的心中，断言活动依赖于使用的证据（EOU），以证明持续侵权的存在。如果没有人使用专利组合所涵盖的技术，那么您的专利并不那么有价值。相反，当有柜会时，专利组合的价值更大。

02. May

Electric Cars Gain Traction, But Challenges Remain

(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.

22 4月

TechInsights.memory technology update from IEDM18

Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees

11 4月

9X Layer 3D NAND Analysis

Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L

10 4月

三星Galaxy S10 5G拆除

Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world

09. 4月

Analyzing innovations in mobile radio frequency front-end integration

发布:2019年4月09年移动射频前端弧hitectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support

09. 4月

Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison

最初呈现：2019年4月9日至2:00至下午3:00 et托管：Michel Roy低密度扇出包技术已经存在十多年。由于RDL计数和线路空间/线宽的功能的限制，这

09. 4月

3D NAND Metrologology挑战生长

(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due

09. 4月

自治车辆正在推动创新

AVS的进步在多种技术领域中具有涟漪效应，从雷达和LIDAR到信号处理。然而，快速创新步伐也为汽车制造商创造了挑战。

29 Mar

西门子专利申请攀登，但质量超过数量是游戏的名称

In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...

25 Mar

三星Galaxy S10 +拆除

Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in

01. Mar

Webinar: The Mobile Radio Frequency Landscape

Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve

27 Feb

Lenovo Brings the New Snapdragon to Market

发布时间：2019年2月20日贡献作者：Stacy Wegner和Daniel Yangeel Yangovo Z5 Pro GT您将需要多长时间1到220,000可能超过32秒，据报道，32秒据据据说联想出售多久

20 Feb

Navitas发现在RavPower RP-PC104-W氮化镓45 W USB C电源充电器

Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to

07. Feb

Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication

Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and

07. Feb

网络研讨会：寻找技术中使用的证据 - 善良，坏的和丑陋

Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can

12 Dec

Webinar: Using Technical Evidence to Strengthen Patents

最初提出：2018年10月23日至2018 / 12:00至下午1:00托管：Mary Lupul专利加强是我们用来描述可以在起诉期间可以应用的不同方法来最大限度地提高乐动体育博彩下载专利的有用性

23 Oct

网络研讨会：优化专利起诉以实现更强，更有价值的专利

Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –

04. Oct

网络研讨会：将领先的STB，流设备和智能电视进行比较 - 设计和BOM视角

最初呈现：2018年9月18日/ 00 PM至3:00 PM et托管：Stacy Wegner具有显着的电线切割趋势，据说经营者如何响应和修改其产品，以保留流动诱惑的投资

18 九月

Automotive Patents: Owners, Technologies, and Investigating for EOU

最初呈现：2018年7月11日至2:00至下午3:00 et主持：Jim Hines汽车行业正面临着新的市场进入者的破坏，新兴的流动性商业模式以及改变对汽车所有权的消费者态度。未来

11 Jul

Creating Better Applications Through Patent Strengthening

乐动体育博彩下载专利加强是我们用来指的术语，以指在检察机会期间从专利期间实现最大的价值潜力 - 在甚至被授予专利之前。

20 Jun

Intel 10 nm Logic Process Analysis (Cannon Lake)

Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor

12 Jun

SK hynix 72L 3D NAND Analysis

Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time

31 May

TIPS - Investigating Patented Technology in Challenging Product Areas

Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas

最初呈现：2018年5月3日至3:15 PM至4:00 PM ET主持：Martin Bijman“黑匣子揭示”是我们用来指的“硬质品” - 技术，这是一个原因或另一个难以分析使用证据。这些可以

03. May

What does Uber’s patent landscape look like?

发布时间：2018年2月27日贡献作者：Marty Bijman最近，Iam的Timothy Au发布了一篇博客，提供了外观优步的投资组合。博客参考了优步的投资组合化妆，并在过去5年中提供了他们的IP事件的编年史

27 Feb

Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond

Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –

20 Feb

Webinar: Unlocking the Value in Software Patents - a Technical Perspective

Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software

01. Feb

COVID-19

我们一直密切监测Covid-19最近几周的进度，定期更新我们的旅行和运营政策，包括我们选择实施的越来越严格的限制。我们的优先事项是确保持续的健康状况

04. Mar

职位空缺：VP，金融控制员

向首席财务官报告，作为副民族的财务，您将为负责日常会计，工资单，税务和财政部，报告，规划，预算和法定申请负责的财务团队成员提供领导。您将规范公司

11 九月

Job Vacancy: Software Developer

我们目前正在寻求一个完整的堆栈软件开发人员，加入我们的科罗拉多州TechInsights平台开发团队。您是否对解决复杂和有趣的问题有热情？你努力每天学习新的东西吗？你

11 九月

职位空缺：销售代表

The Inside Sales Representative is a key member of the go-to-market sales team. Working in close cooperation with the outside sales and Marketing teams, you will be responsible for following up on leads while identifying new business or sales

10 九月

Job Vacancy: VP, Sales Operations

Thanks to our growth, we are now recruiting an individual to lead our Sales Operations functions and further evolve the business via the support of our corporate goals and objectives, including, but not limited to: reporting, analysis, business

09. 九月

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